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Odisha Signs $3.3B Semiconductor Pact With Intel & 3DGS
The Odisha government has struck a major deal with Intel and 3D Glass Solutions (3DGS), based in the US. They signed a memorandum of understanding on May 28, 2026, in California, aiming to bring state-of-the-art substrate manufacturing technology to
BREAKINGOdisha govt signs semiconductor substrate manufacturing pact with Intel, 3DGS: Ashwini Vaishnaw - www.lokmattimes.com
Odisha govt signs semiconductor substrate manufacturing pact with Intel, 3DGS: Ashwini Vaishnaw - New Delhi, May 29 The Odisha government has signed a memorandum of understanding (MoU) with Intel and 3D ... - Latest News. Find Breaking Headlines, Current and …