The Odisha government has struck a major deal with Intel and 3D Glass Solutions (3DGS), based in the US. They signed a memorandum of understanding on May 28, 2026, in California, aiming to bring state-of-the-art substrate manufacturing technology to For the full story, visit the source.
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Odisha Signs $3.3B Semiconductor Pact With Intel & 3DGS
The Odisha government has struck a major deal with Intel and 3D Glass Solutions (3DGS), based in the US. They signed a memorandum of understanding on May 28, 2026, in California, aiming to bring state-of-the-art substrate manufacturing technology to
By Vinay Kakkad· Kalinga TV· 4 months ago· 2 min read
This summary is sourced from Kalinga TV. Read the full article at:Kalinga TV