#advanced-packaging
Focus on design, packaging over wafer race: NITI Aayog
NITI Aayog urges India to prioritise chip design, OSAT and advanced packaging over the foundry “wafer race,” targeting $120–150bn value chain by 2035.
Tata Electronics' $30b fab bet; Ather's Q4 revenue surge
Tata Electronics CEO Randhir Thakur lays out the group’s big swing in fabs, advanced packaging and more in an interaction with ET. This and more in today's ETtech Top 5.